Frequently Asked Questions
Our key deliverables are highly actionable and compatible with industry-standard EDA flows:
Validated S-Parameter Models: Frequency-domain models (Touchstone) for all critical signal channels and the Power Delivery Network (PDN) up to the required frequency (e.g., 40 GHz+).
Time-Domain Simulation Reports: Comprehensive reports on Eye Diagrams, Jitter analysis, and Bit Error Rate (BER) performance demonstrating compliance with your target specifications.
Optimized Decoupling Strategy: A complete bill of materials (BOM) and placement guide for high-frequency and bulk decoupling capacitors across the die, interposer, and substrate.
Co-Design Rule Recommendations: Specific, design-rule-level feedback (trace geometry, stack-up, via structures) for the substrate team to ensure manufacturability (DFM) and performance.
Internal teams often excel at board-level SI/PI. We step in where complexity increases exponentially:
Full-Wave Expertise: Internal teams often rely on simplified 2D/2.5D field solvers. We provide expertise in high-fidelity 3D Full-Wave EM specifically for complex, non-uniform structures like TSVs, micro-bumps, and high-aspect-ratio package vias.
Multi-Domain Co-Simulation: We possess the methodology to rigorously co-simulate the entire system—silicon, interposer, package, and PCB—as a single unit, which is essential for accurate PDN impedance targeting.
Cost/Performance Trade-offs: Our experience allows us to quickly model the performance impact of cost-saving measures (e.g., reducing layer count, changing material sets), providing data-backed recommendations on the optimal balance.
On the contrary, we are designed to accelerate your Time-to-Market:
Upfront Predictive Analysis: By identifying SI/PI risks early in the package architecture phase, we eliminate the need for costly, time-consuming post-silicon package re-spins.
Parallel Execution: We work in parallel with your physical design team, providing real-time design checks and rapid trade-off analysis (e.g., substrate stack-up optimization).
Reduced Iterations: Our validated, first-time-right approach drastically reduces the overall design iterations, a major source of schedule delays in advanced semiconductor development.
Our expert team arrives equipped with a portable, state-of-the-art EMC pre-compliance test setup, including calibrated spectrum analyzers, EMI receivers, various antennas, near-field probes, signal generators, and all necessary supporting equipment to conduct accurate diagnostics at your location. Additionally, for highly sensitive measurements or when isolating your product's emissions is crucial, we can deploy our mobile anechoic chamber, offering over 100 dB of RF isolation, which can be fully set up in a matter of minutes.
Absolutely. A key advantage of our on-site service is the immediate diagnostic and troubleshooting support provided by our experienced EMC engineers. We work with your team in real-time to pinpoint the root cause of EMI issues and recommend effective mitigation strategies. We also leverage advanced simulation tools to quickly streamline troubleshooting efforts, allowing for rapid analysis and virtual testing of potential solutions before implementing physical changes.
Our comprehensive design process begins with detailed requirements analysis and architectural definition. This moves into physical design, layout, and extensive multi-physics simulations (electrical, thermal, mechanical). We emphasize Design for Manufacturability (DFM) and rigorous verification to ensure a first-time-right design.
We provide design services for a wide range of ASIC package types, including high-density BGAs, LGAs, QFNs, and advanced custom multi-chip modules (MCMs) or System-in-Package (SiP) solutions, utilizing both wire bond and flip-chip interconnect technologies tailored to your specific application needs.
We focus on defining and validating the physical interface specifications:
Interface Definition: We work with your team to establish clear, robust interface specifications for signal timing, voltage rails, impedance targets, and noise budgets at the die-to-die interface.
Die-Level Model Utilization: We can integrate vendor-provided I/O Buffer Information Specification (IBIS) models, power models, and highly detailed package models (S-parameters/Touchstone files) into a single, comprehensive System-in-Package (SiP) simulation environment.
Optimization: We then focus on optimizing the passive structures (interposer traces, package routing, PDN capacitors) to bridge performance gaps between the various chiplet IPs.
Our signal integrity products, including advanced simulation models and measurement tools, enable precise analysis of signal behavior, identify potential issues like reflections and crosstalk, and guide designers in implementing optimal impedance matching, termination strategies, and routing guidelines to improve signal quality.
Our products are designed for hardware engineers, PCB designers, ASIC/chiplet/MCM package designers, system architects, and companies across various industries, including data centers, telecommunications, automotive, and aerospace, who require robust solutions for high-speed electronic design challenges.
There are multiple ways to contact us.
You can fill out the contact form on our Contact page.
You can also contact us by chat on our website.
You can e-mail us directly at info@signaledgesolutions.com
You can also reach us at 301.887.3371 and by leaving a voicemail.