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Mar 7, 2024

Signal Edge Solutions partners with Sarcina

Baltimore, Maryland, March 7, 2024 – Signal Edge Solutions, a premier provider of innovative electronic solutions, today announced a strategic partnership with Sarcina Technology, the Application Specific Advanced Packaging leader. This partnership signifies a significant milestone for Signal Edge Solutions as it expands its services to include ASIC (Application-Specific Integrated Circuit) package design, testing, and manufacturing markets across the United States.

As part of this collaboration, Signal Edge Solutions will leverage its expertise to provide ASIC package design and testing services while tapping into Sarcina Technology's advanced manufacturing capabilities for ASIC package and chiplet production. This comprehensive approach ensures seamless integration from design to production, offering customers unparalleled quality and efficiency.

"We are excited to join forces with Sarcina Technology to bring advanced ASIC and chiplet package design, and production services to new markets in the U.S.,” said Benjamin Dannan, Chief Technologist and Owner of Signal Edge Solutions. “This partnership underscores our commitment to delivering cutting-edge solutions to our customers, empowering them to meet the demands of today’s rapidly evolving electronics industry.”

“A partnership with Signal Edge Solutions is a significant step forward for the small-to-mid sized IC innovators who are finding required leading-edge package designed a financial and technical challenge.  As an applications specific advanced packaging company, Sarcina and Signal Edge Solutions provide cost-effective fast time-to-market resources that innovators might not be able to afford in-house,” explains Larry Zu, CEO, Sarcina Technology.

Advanced packaging is the new frontier of semiconductor technology as ASICs and chiplet technologies play increasing critical roles. With the combined expertise of Signal Edge Solutions and Sarcina Technology, customers can expect customized ASIC and chiplet packages tailored to their specific needs, and designed to optimize performance, while minimizing size and power consumption.

The Signal Edge Solutions and Sarcina Technology partnership marks a significant step forward in providing customers comprehensive electronic solutions that address their evolving needs and drive innovation.

For more information about Signal Edge Solutions' ASIC package design and manufacturing services in partnership with Sarcina Technology, visit


Signal Edge Solutions, LLC.

About Signal Edge Solutions

Signal Edge Solutions was founded on the belief that there is a significant gap in the signal integrity and power integrity (SI/PI) field. Signal Edge Solutions is addressing this gap by providing highly advanced services and products that focus on high-speed measurement, measurement-based modeling, and electromagnetic (EM) modeling services tailored to ASIC, package, and printed circuit board (PCB) design, in addition to other specialized engineering consulting services, which includes ASIC package design, chiplet package design, end-to-end SI/PI simulation modeling of complex ASICs and FPGA designs.

All logos and trademarks in this release are property of their respective owners.

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