Advanced Package Design:
​ASIC, Chiplet, FPGA, and Interposer
Advanced packaging technology plays a significant role in the performance of ASICs, chiplets, multi-chip modules (MCM), FPGAs, and interposers. Signal Edge Solutions has the expertise to help you successfully design and manufacture your next ASIC package or chiplet package design.
We approach every project from a rigorous SI/PI perspective, modeling the entire channel from the silicon die through the interposer, package, and PCB to ensure total system integrity. Our expertise scales across the full spectrum of thermal and electrical
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demands, from high-efficiency 30W packages to ultra-high-performance 4000W AI and data center solutions. By performing integrated co-simulation of signal transitions and power delivery networks at this scale, we mitigate the risks of crosstalk, voltage droop, overshoot, undershoot, and stability, ensuring your high-power designs maintain world-class performance without compromising reliability.
High-Performance FPGA & ASIC Support
Modern FPGAs and ASICs demand massive currents at sub-1.0V levels with incredibly fast transient requirements. We specialize in the "Vertical PDN," managing the path from the VRM through the PCB, into the package, and finally to the on-die capacitance.
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Package-Die Design: We extract detailed models of the package substrate to optimize pinouts for maximum signal isolation and minimum power loop inductance.
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SerDes Characterization: From 1G to 224G, we verify that your ASIC or FPGA transceiver channels meet the specific compliance standards for PCIe, Ethernet, and OIF-CEI.
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​DDR Characterization: We provide exhaustive physical layer validation for DDR4, DDR5, LPDDR, GDDR, HBM interfaces. Our analysis covers everything from write/read eye margins and terminal reflections to complex command/address bus timing, ensuring your memory subsystem meets stringent JEDEC compliance across all process corners.
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Power Integrity Package Design: We specialize in the co-design of the package and die PDN to minimize high-frequency impedance. By modeling the interaction between on-die capacitance, package planes, and C4 bumps, we optimize the power delivery path for ultra-high-power applications, ranging from 30W to 4000W, ensuring stable voltage rails even during massive di/dt transient events.
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UCIe: We optimize high-density die-to-die interconnects, ensuring the power efficiency and terabit-per-second throughput required for next-generation chiplet architectures.
224G SerDes Characterization
Interposer Modeling
Interposers introduce a new layer of electromagnetic complexity, particularly regarding through-silicon vias (TSVs) and fine-pitch RDL routing.
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Full-Wave EM Extraction: Using our 3D EM solvers, we characterize the parasitic capacitance and inductance of TSVs and interposer traces, identifying potential resonances that can occur at multi-gigahertz frequencies.
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Electrothermal Awareness: We analyze the thermal gradients within the interposer stack, ensuring that heat dissipation from high-power logic die doesn't lead to mechanical stress or electrical performance degradation.
Why Signal Edge Solutions for Silicon-Level Design?
Designing at the chip and package level leaves zero room for error. As members of JEDEC and PCI-SIG, we bring a standards-based rigor to your silicon project. We provide the "End-to-End" transparency that standard vendor models lack, giving you a clear view of the physics governing your most advanced designs.
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Contact us to discuss your project today.
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Advanced Packaging Insights
At Signal Edge Solutions, we strive to solve the most challenging problems in advanced package design. Our team of experts is always developing educational resources and sharing insights. Check out some of our suggested reading below.​​